Surface Treatment and Ultra-selective Materials Removal
Precision Surface Treatment and Ultra-Selective Materials Removal
Continuous integrated circuit device scaling includes fabrications of small, deep and complex 3D structures composed of thin layers of different materials. Manufacturing requires ultra-high selectivity in materials removal processes, and a precise control of physical, chemical and electrical properties of thin film surfaces.
Products
Product Family
Based on an excellent remote plasma technology, The Company’s selective material removal systems offer unique process solutions and deliver superior and tunable selectivity in removal of dielectric and conductor thin film materials. The Company’s selective material removal systems are ideal solutions for memory, logic/foundry, and power IC fabrication.
