Fremont, California, March 8, 2018 – Mattson Technology introduces the most innovative technology with its NovykaTM product family for atomic level surface treatment and ultra-selective etching of extremely thin and delicate materials for continued scaling of 3D logic and memory devices.

“There are significant challenges in scaling with 3D structures for advanced memory and logic chips that include small, narrow, deep and complicated features composed of thin layers of different materials. Among these manufacturing challenges is selective removal of certain layers without damaging or removing other layers and without affecting other features,” said Dr. Subhash Deshmukh, Chief Business Officer in Mattson Technology. “Another challenge is cleaning of these complex structures, as wet chemistry is no longer able to meet the requirements of cleaning the very bottom of the high-aspect ratio features while maintaining device structure integrity.”

“Our new Novyka^TM products offer proprietary chemistries in surface cleaning, surface treatment and surface modification. With unique Novyka^TM product designs, they are further extended to enable ultra-high selectivity in removal of thin and delicate layers in 3D device structures”, said Dr. Michael Yang, Executive Vice President and Chief Technology Officer of Mattson Technology. “In addition to delivering the most innovative process solutions to some of the key technical issues in the industry, Novyka^TM products have the lowest running cost, or the best total cost of ownership in its class.”

“We are very excited about the potential of Novyka^TM products as we are working closely with several of our most advanced customers on a variety of leading edge applications. With Mattson Technology achieving record revenue and profit in 2017, we continue to relentlessly drive technology innovations and provide uncompromising service to our global customer base”, commented Dr. Allen Lu, CEO and President of Mattson Technology.