Dry Strip
Provide unique Dry Strip technology
Dry Strip
Dry strip is the removal of the masking layers from the wafer after the patterning process has been completed. The objective is to eliminate the masking material from the wafer as quickly as possible, without allowing any surface materials to become damaged.
We have maintained a notable presence in the dry strip market. Our strip systems offer innovative wafer handling architecture to deliver cost-effective integrated circuit manufacturing solutions to help customers reduce usage costs.
Products
Family Plasma Dry Strip
The Company’s plasma dry strip and advanced patterning film removal systems have unique remote ICP source and twin wafer chamber design. Each process chamber is equipped with a dedicated vacuum transfer module for maximum process flexibility and extendibility.
The Company’s plasma dry strip and advanced patterning film removal systems have demonstrated excellent process performance, superior particulate contamination and low cost of ownership in volume production. They are great choices for photoresist strip and advanced patterning film removal in semiconductor fabrication worldwide.
