Products & Solutions
We design and manufacture wafer processing equipment
used in the fabrication of integrated circuits (ICs)
Overview
We design and manufacture wafer processing equipment used in the fabrication of integrated circuits (ICs). Our manufacturing equipment utilizes innovative technologies to deliver advanced processing capabilities and high productivity for the fabrication of current- and next-generation ICs in the following product sectors: Dry Strip, Plasma Etch, Rapid Thermal Processing (RTP), Surface Treatment and Ultra-Selective Materials Removal etc. the following product sectors: Dry Strip, Plasma Etch, Rapid Thermal Processing (RTP), Surface Treatment and Ultra-Selective Materials Removal etc.
Products
Our products deliver leading-edge wafer processing at high productivity levels which provide our customers with the most cost-effective manufacturing solution. Our tools are used by leading technology companies and are in full production at advanced semiconductor manufacturing, including DRAM, NAND and foundry/logic manufacturing companies.
01
Dry Strip
Dry strip is the removal of the masking layers from the wafer after the patterning process has been completed.
02
Plasma ETCH
Etching is the process of selectively removing mask patterned materials from the wafer’s surface to create desired patterns on the wafer’s surface. Plasma etch is the use of a radio frequency (RF) excited plasma to produce chemically reactive species from various gases.
