Rapid Thermal Processing
Rapid Thermal Processing
Rapid thermal processing equipment is a device that uses the infrared radiation energy of halogen lamps or arc lamps to quickly heat the surface of wafers, so as to achieve the effect of electrical regulation of semiconductor devices. The process temperature of the equipment covers from 380 degrees to 1300 degrees to meet the production needs of different semiconductor devices.
BEST’s RTP products have a wide coverage, including rapid annealing, spike annealing, and millisecond flash annealing.
Products
Family RTP Systems
The Company’s RTP systems offer unique double-side radiative heating RTP technology. It can effectively eliminate pattern loading effect associated with single-side radiative heating, reduce wafer stress, and increase wafer temperature ramp rate and system productivity.
The Company’s RTP systems have the excellent wafer control range, metal contamination performance and production cost. The systems can satisfy technical requirements of leading semiconductor devices (Logic, 3D NAND, DRAM, Power IC, CMOS sensor, SiC) across various technology nodes, and are great choices in both product development and mass manufacturing.
